M. Yusuf Tura Ali is an author at Universiti Sains Malaysia specializing in engineering, electronic packaging, and computer engineering.
Publications per year
2017–2019
2
2
Fei Chong Ng, Aizat Abas, Z L Gan et al. · Microelectronics Reliability · 2017 · 36 citations
Materials Science, Engineering, Nano-silica Filler-reinforced Composite-encapsulant +2
Fei Chong Ng, M. Yusuf Tura Ali, Aizat Abas et al. · The International Journal of Advanced Manufacturing Technology · 2019 · 18 citations
Physical Design (Electronics), Chip-scale Package, Engineering +6
Rows per page
1–2 of 2