J. Ku

BE-SONOS: A bandgap engineered SONOS with excellent performance and reliability

Hang-Ting Lue, Szu-Yu Wang, Erh-Kun Lai et al. · 2006 · 137 citations

Engineering, Electrical Engineering, Materials Science +17

Si FinFET based 10nm technology with multi Vt gate stack for low power and high performance applications

H.-J. Cho, Hwan Sool Oh, Kyunghoon Nam et al. · 2016 · 73 citations

Engineering, Computer Engineering, Electrical Engineering +17

LPE and VPE In<inf>1-x</inf>Ga<inf>x</inf>As<inf>y</inf>P<inf>1-y</inf>/InP: Transport properties, defects, and device considerations

P. Bhattacharya, J. Ku, S. J. T. Owen et al. · IEEE Journal of Quantum Electronics · 1981 · 35 citations

Engineering, Materials Engineering, Materials Science +11

Signal/Power Integrity Modeling of High-Speed Memory Modules Using Chip-Package-Board Coanalysis

Hao-Hsiang Chuang, Wei-Da Guo, Yu-Hsiang Lin et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 31 citations

Engineering, Computer Engineering, Electrical Engineering +17

A Highly Stackable Thin-Film Transistor (TFT) NAND-Type Flash Memory

Erh-Kun Lai, Hang-Ting Lue, Yi‐Hsuan Hsiao et al. · 2006 · 26 citations

Engineering, Computer Engineering, Electrical Engineering +15