Jiamin Ni is an author at IBM (United States) specializing in materials science, materials engineering, and applied physics.
Top concepts
EngineeringApplied PhysicsMaterial ScienceMaterials EngineeringThin FilmsMicrostructureSolid MechanicsMicroelectronicsMechanical BehaviorElectronic Packaging
Publications per year
2009–2018
2
2
Mechanisms of Electromigration Damage in Cu Interconnects
Chunhua Hu, L. Gignac, G. Lian et al. · 2018 · 26 citations
Materials Engineering, Materials Science, Electrical Engineering +13
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1–2 of 2