H. Matsushima

Molded chip scale package for high pin count

Shinji Baba, Y. Tomita, M. Matsuo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part B · 1998 · 26 citations

Engineering, Electrical Engineering, Materials Science +12

Analysis of solder joint fracture under mechanical bending test

Kazuki Harada, Shunsuke Baba, Qiang Wu et al. · 2004 · 25 citations

Engineering, Materials Engineering, Materials Science +13

Chip scale package: "a lightly dressed LSI chip"

Masahiro Yasunaga, Shinji Baba, M. Matsuo et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 24 citations

Engineering, Electrical Engineering, Materials Science +16

Molded chip scale package for high pin count

Shinji Baba, Y. Tomita, M. Matsuo et al. · 2002 · 18 citations

Engineering, Electrical Engineering, Materials Science +12

Thermally enhanced flip-chip BGA with organic substrate

H. Matsushima, Shinji Baba, Y. Tomita et al. · 2002 · 10 citations

Engineering, Electrical Engineering, Materials Science +17