M. Ameson is an author at 3M (United States) specializing in computer architecture, electrical engineering, and 3d printing.
Top concepts
3D PrintingEngineeringApplied PhysicsMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingFlexible ElectronicsComputer ArchitectureElectrical Engineering
Publications per year
2000–2000
1
1
Ultra-thin electronic device package
K.Y. Chen, R.L.D. Zenner, M. Ameson et al. · IEEE Transactions on Advanced Packaging · 2000 · 45 citations
3D Ic Architecture, Electrical Engineering, Chip-scale Package +15
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