R.L.D. Zenner

Reactive arc vapor ion deposition of TiN, ZrN and HfN

O.A. Johansen, J.H. Dontje, R.L.D. Zenner · Thin Solid Films · 1987 · 65 citations

Materials Engineering, Materials Science, Engineering +8

Ultra-thin electronic device package

K.Y. Chen, R.L.D. Zenner, M. Ameson et al. · IEEE Transactions on Advanced Packaging · 2000 · 45 citations

3D Ic Architecture, Electrical Engineering, Chip-scale Package +15

Conductive adhesive flip-chip bonding for bumped and unbumped die

G. Connell, R.L.D. Zenner, Johan Andries Kritzinger Gerber · 2002 · 16 citations

Materials Science, Conductive Adhesive Interconnection, Unbumped Die +14

Ultra-thin electronic device package

Kai Chen, R.L.D. Zenner, M. Arneson et al. · 2003 · 11 citations

Engineering, Computer Architecture, New Applications +17