Sang Hwui Lee

Structure, Design and Process Control for Cu Bonded Interconnects in 3D Integrated Circuits

Kuan‐Neng Chen, Sang Hwui Lee, Paul Andry et al. · 2006 · 77 citations

Engineering, Integrated Circuits, Integration Technology +20

Low Temperature Wafer Bonding by Copper Nanorod Array

Pei‐I Wang, Sang Hwui Lee, Thomas Parker et al. · Electrochemical and Solid-State Letters · 2009 · 52 citations

Materials Science, Dense Cu, Engineering +13

Fine Keyed Alignment and Bonding for Wafer-Level 3D ICs

Sang Hwui Lee, Frank Niklaus, J. J. McMahon et al. · MRS Proceedings · 2006 · 17 citations

3D Ic Architecture, Wafer Scale Processing, Engineering +5

Low Temperature Copper-Nanorod Bonding for 3D Integration

Pei‐I Wang, Tansel Karabacak, Jian Yu et al. · MRS Proceedings · 2006 · 16 citations

Materials Science, 3D Ic Architecture, Wafer Scale Processing +4