T. Kirkpatrick

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, Hairong Jiang, L.P. Lehman et al. · IEEE Transactions on Components and Packaging Technologies · 2008 · 260 citations

Engineering, Materials Engineering, Materials Science +17

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

Thomas R. Bieler, H. Jiang, L.P. Lehman et al. · 2006 · 86 citations

Engineering, Materials Engineering, Materials Science +17

Hot electron effect in nanoscopically thin photovoltaic junctions

Krzysztof Kempa, Michael Naughton, Zhiwei Ren et al. · Applied Physics Letters · 2009 · 49 citations

Engineering, Electrical Engineering, Materials Science +17

Stress effects on the Raman spectrum of an amorphous material: Theory and experiment on<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"><mml:mi>a</mml:mi></mml:math>-Si:H

David A. Strubbe, Eric Johlin, T. Kirkpatrick et al. · Physical Review B · 2015 · 38 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Ultrasensitive Chemical Detection Using a Nanocoax Sensor

Huaizhou Zhao, Binod Rizal, G. McMahon et al. · ACS Nano · 2012 · 33 citations

Engineering, Materials Engineering, Materials Science +17