Toshinori Ogashiwa

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Active since

2007

Affiliations

National Institute for Materials Science(Current)

Toshinori Ogashiwa is an author at National Institute for Materials Science specializing in materials science, materials engineering, and wafer bonding.

Publications per year

2007–2021

Publications

Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles

Hiroyuki Ishida, Toshinori Ogashiwa, Takuya Yazaki et al. · Transactions of The Japan Institute of Electronics Packaging · 2010 · 23 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Electrical interconnection in anodic bonding of silicon wafer to LTCC wafer using highly compliant porous bumps made from submicron gold particles

Shuji Tanaka, Mamoru Mohri, Toshinori Ogashiwa et al. · Sensors and Actuators A Physical · 2012 · 21 citations

Engineering, Materials Engineering, Materials Science +16

Low-Temperature Bonding Technique Using Sub-Micron Au Particles

Toshinori Ogashiwa, Tadahiro Shibutani, Masayuki Miyairi et al. · Journal of The Japan Institute of Electronics Packaging · 2007 · 15 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Anisotropic microstructural evolution and coarsening in free sintering and constrained sintering of metal film by using FIB-SEM tomography

Gaku Okuma, Ryo Miyaki, Kan Shinobe et al. · Acta Materialia · 2021 · 11 citations

Engineering, Materials Engineering, Materials Science +13

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