Haoxiang Ren

Statistics

Publications

Citations

127

H-Index

Active since

2019

Affiliations

University of California, Los Angeles(Current)

Samueli Institute

Beijing Institute of Technology

Haoxiang Ren is an author at University of California, Los Angeles specializing in electrical engineering, electronic packaging, and microelectronics.

ORCID

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingElectrical EngineeringApplied PhysicsMicrofabricationAdvanced PackagingIntegrated CircuitsThin Films

Publications per year

2019–2023

Publications

Probing Phase Distribution in 2D Perovskites for Efficient Device Design

Na Liu, Pengfei Liu, Haoxiang Ren et al. · ACS Applied Materials & Interfaces · 2019 · 54 citations

Mechanism and Process Window Study for Die-to-Wafer (D2W) Hybrid Bonding

Haoxiang Ren, Yu-Tao Yang, Guangqi Ouyang et al. · ECS Journal of Solid State Science and Technology · 2021 · 18 citations

Materials Science, Materials Engineering, Electrical Engineering +15

A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration

Krutikesh Sahoo, Haoxiang Ren, Subramanian S. Iyer · 2023 · 18 citations

Engineering, High Throughput, Thermal Compression Bonding +19

Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding

Haoxiang Ren, Yu-Tao Yang, Subramanian S. Iyer · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 15 citations

Engineering, Mechanical Engineering, Thermal Compression Bonding +17

Surface diffusion controlled reaction in small size microbumps

Yingxia Liu, Xiuyu Shi, Haoxiang Ren et al. · Materials Letters · 2020 · 11 citations

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