Y.-H. Lee

Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects

C. W. Chang, S. E. Liu, B. L. Lin et al. · 2015 · 41 citations

Engineering, Electrical Engineering, Materials Science +17

Prediction of NBTI degradation for circuit under AC operation

Y. S. Tsai, Niraj K. Jha, Y.-H. Lee et al. · 2010 · 22 citations

Engineering, Electrical Engineering, Microelectronics +16

The physical mechanism investigation of AC TDDB behavior in advanced gate stack

C.L. Chen, S. W. Chang, S.C. Chen et al. · 2014 · 20 citations

Engineering, Electrical Engineering, Materials Science +14

Consideration of BTI variability and product level reliability to expedite advanced FinFET process development

Y.-H. Lee, J H. Lee, Yih Wang et al. · 2016 · 20 citations

Engineering, Computer Engineering, Electrical Engineering +17

The impact and implication of BTI/HCI decoupling on ring oscillator

Min-Hsiu Hsieh, Yu‐Lien Huang, T.-Y. Yew et al. · 2015 · 17 citations

Engineering, Electrical Engineering, Electronic Materials +14