Y.J Mei

The effects of plasma treatment for low dielectric constant hydrogen silsesquioxane (HSQ)

Po‐Tsun Liu, Ting‐Chang Chang, Simon M. Sze et al. · Thin Solid Films · 1998 · 81 citations

Natural Sciences, Chemistry, Physics +10

Recovering Dielectric Loss of Low Dielectric Constant Organic Siloxane during the Photoresist Removal Process

Ting‐Chang Chang, Y. S. Mor, Po‐Tsun Liu et al. · Journal of The Electrochemical Society · 2002 · 42 citations

Natural Sciences, Chemistry, Materials Science +17

Eliminating dielectric degradation of low-<i>k</i> organosilicate glass by trimethylchlorosilane treatment

Ting‐Chang Chang, Po‐Tsun Liu, Y. S. Mor et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 2002 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +10

Enhancing the resistance of low-k hydrogen silsesquioxane (HSQ) to wet stripper damage

Tien‐Chun Chang, Y. S. Mor, Po‐Tsun Liu et al. · Thin Solid Films · 2001 · 24 citations

Natural Sciences, Chemistry, Materials Science +6

Influence of extraction pH and homogenization on soybean oleosome emulsion stability

Chenqiang Qin, Mingzhao Han, Rao Fu et al. · LWT · 2024 · 18 citations · Full text

Agriculture, Biochemistry, Food Science +17