Martin Eigner

Microcontacts with sub-30μm pitch for 3D chip-on-chip integration

H. Huebner, S. Penka, B. Barchmann et al. · Microelectronic Engineering · 2006 · 82 citations

3D Ic Architecture, Electrical Engineering, Engineering +9

AN APPROACH FOR THE IMPLEMENTATION OF THE DIGITAL TWIN IN THE AUTOMOTIVE WIRING HARNESS FIELD

Rajeeth Tharma, R. Winter, Martin Eigner · Proceedings of the ... International Design Conference/Design ... · 2018 · 45 citations · Full text

An Approach, Engineering, Digital Twinning +7

PROPOSAL FOR FUNCTIONAL PRODUCT DESCRIPTION AS PART OF A PLM SOLUTION IN INTERDISCIPLINARY PRODUCT DEVELOPMENT

Martin Eigner, Torsten Gilz, Radoslav Zafirov · DS 70: Proceedings of DESIGN 2012, the 12th International Design Conference, Dubrovnik, Croatia · 2012 · 33 citations

Engineering, Collaborative Design, Industrial Engineering +18

A DIGITAL TWIN FOR ROOT CAUSE ANALYSIS AND PRODUCT QUALITY MONITORING

Alexander Detzner, Martin Eigner · Proceedings of the ... International Design Conference/Design ... · 2018 · 31 citations · Full text

Software Maintenance, Root Cause Analysis, Engineering +18

A Metadata Repository for Semantic Product Lifecycle Management

Thomas Eickhoff, Andreas Eiden, Jens C. Göbel et al. · Procedia CIRP · 2020 · 19 citations · Full text

Software Maintenance, Metadata Repository, Engineering +24