Artur Wymysłowski

Publications

145

Citations

H-Index

1996

Active since

Affiliations

Wrocław University of Science and Technology(Current)

Fraunhofer Institute for Manufacturing Technology and Advanced Materials

Artur Wymysłowski is an author at Wrocław University of Science and Technology specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingHeat TransferApplied PhysicsMicroelectronicsThermal EngineeringMechanical EngineeringThermodynamicsMicrofabrication

Publications per year

1996–2020

Publications

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

D. Chicot, K. Tilkin, Krystian Jankowski et al. · Microelectronics Reliability · 2013 · 25 citations

Materials Science, Microindentation Technique, Microelectronic Packaging +10

Adhesion work analysis through molecular modeling and wetting angle measurement

Dawid Jan Król, Artur Wymysłowski, Kamil Nouri Allaf · Microelectronics Reliability · 2015 · 17 citations

Materials Science, Engineering, Microfabrication +10

2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski · Microelectronics Reliability · 2011 · 16 citations

Engineering, Multi-physics Simulation, Physics +15

Lab-on-Chip Platform for Culturing and Dynamic Evaluation of Cells Development

Danylo Lizanets, Dawid Przystupski, Wojciech Kubicki et al. · Micromachines · 2020 · 16 citations · Full text

Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach

Artur Wymysłowski, Jana Kolbe, K.M.B. Jansen et al. · Microelectronics Reliability · 2007 · 14 citations

Materials Science, Engineering, Mechanical Engineering +9

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