Concepedia

K. Tilkin

KT

Statistics

Publications

1

Citations

25

H-Index

1

Active since

2013

Affiliations

Wrocław University of Science and Technology(Current)

K. Tilkin is an author at Wrocław University of Science and Technology specializing in microelectronics, package-level reliability, and engineering.

Publications per year

2013–2013

1

Publications

1

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

D. Chicot, K. Tilkin, Krystian Jankowski et al. · Microelectronics Reliability · 2013 · 25 citations · Full text

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