Won Sik Hong

Study on the degradation of different types of backsheets used in PV module under accelerated conditions

Namsu Kim, Hyun-Woo Kang, Kyung‐Jun Hwang et al. · Solar Energy Materials and Solar Cells · 2013 · 70 citations

Electrical Engineering, Accelerated Conditions, Engineering +5

Accelerated life test of high power white light emitting diodes based on package failure mechanisms

S.I. Chan, Won Sik Hong, K. T. Kim et al. · Microelectronics Reliability · 2011 · 44 citations

White Oled, Electrical Engineering, Reliability Engineering +10

Pressureless Silver Sintering of Silicon-Carbide Power Modules for Electric Vehicles

Won Sik Hong, Mi Song Kim, Chulmin Oh et al. · JOM · 2019 · 40 citations

Materials Science, Materials Engineering, Electrical Engineering +5

Evaluation of solder joint reliability in flip-chip packages during accelerated testing

Jong‐Woong Kim, Dae‐Gon Kim, Won Sik Hong et al. · Journal of Electronic Materials · 2005 · 37 citations

Reliability, Reliability Engineering, Engineering +10

Silver Sintered Joint Property Between Silicon Carbide Device and Ceramic Substrate for Electric Vehicle Power Module

Won Sik Hong, Mi Song Kim, Dajung Kim et al. · Journal of Electronic Materials · 2018 · 21 citations

Materials Science, Electrical Engineering, Engineering +4