Jianquan Sang

Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness

Jianquan Sang, Ye Yuan, Wulin Yang et al. · Journal of Alloys and Compounds · 2021 · 70 citations

Materials Science, Materials Engineering, Diamond-like Carbon +9

Enhanced thermal conductivity of copper/diamond composites by fine-regulating microstructure of interfacial tungsten buffer layer

Jianquan Sang, Lingping Zhou, Wulin Yang et al. · Journal of Alloys and Compounds · 2020 · 53 citations

Materials Science, Materials Engineering, Enhanced Thermal Conductivity +11

Low-temperature synthesizing SiC on diamond surface and its improving effects on thermal conductivity and stability of diamond/Al composites

Xiangjun Li, Wulin Yang, Jianquan Sang et al. · Journal of Alloys and Compounds · 2020 · 49 citations

Materials Engineering, Materials Science, Diamond-like Carbon +7

Regulating interface adhesion and enhancing thermal conductivity of diamond/copper composites by ion beam bombardment and following surface metallization pretreatment

Jianquan Sang, Wulin Yang, Jiajun Zhu et al. · Journal of Alloys and Compounds · 2018 · 45 citations

Materials Engineering, Materials Science, Diamond-like Carbon +8

Overcoming selective interfacial bonding and enhancing thermal conductivity of diamond/aluminum composite by an ion bombardment pretreatment

Wulin Yang, Jianquan Sang, Lingping Zhou et al. · Diamond and Related Materials · 2017 · 25 citations

Materials Science, Materials Engineering, Diamond-like Carbon +7