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Enhanced thermal conductivity of copper/diamond composites by fine-regulating microstructure of interfacial tungsten buffer layer

Materials ScienceMaterials EngineeringEnhanced Thermal ConductivityDiamond-like CarbonEngineeringThermal TransportApplied PhysicsThermal PropertyThermal ConductionHeat TransferThermal ConductivityThermal EngineeringCopper/diamond CompositesInterfacial Tungsten