Publication | Closed Access
Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness
70
Citations
54
References
2021
Year
Materials ScienceMaterials EngineeringDiamond-like CarbonEngineeringThermal TransportApplied PhysicsThermal ConductionThermal ConductivityThermal EngineeringInterface ThicknessCopper/diamond CompositesThermal Property
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