Daire Cott

Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

Nicolò Chiodarelli, Sugiura Masahito, Yusaku Kashiwagi et al. · Nanotechnology · 2011 · 113 citations

Engineering, Contact Resistance, Interconnect (Integrated Circuits) +22

2D materials: roadmap to CMOS integration

Cedric Huyghebaert, T. Schram, Quentin Smets et al. · 2018 · 94 citations

Engineering, Device Integration, Low Dimensional Material +17

Preparation of Oriented Mesoporous Carbon Nano-Filaments within the Pores of Anodic Alumina Membranes

Daire Cott, Nikolay Petkov, Michael A. Morris et al. · Journal of the American Chemical Society · 2006 · 73 citations

Integration and electrical characterization of carbon nanotube via interconnects

Nicolò Chiodarelli, Yunlong Li, Daire Cott et al. · Microelectronic Engineering · 2010 · 66 citations

Electrical Engineering, Engineering, Carbon-based Material +6

Growth of vertically-aligned carbon nanotube forests on conductive cobalt disilicide support

Chuding Zhang, Feng Yan, Christopher S. Allen et al. · Journal of Applied Physics · 2010 · 61 citations

Materials Science, Chemical Engineering, Nanosheet +14