Chun-Wei Lu

Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

Wei‐Ping Dow, De-Huei Liu, Chun-Wei Lu et al. · Electrochemical and Solid-State Letters · 2010 · 52 citations

Materials Science, Electrometallurgy, Chemical Engineering +9

Highly Selective Cu Electrodeposition for Filling Through Silicon Holes

Wei‐Ping Dow, Chun-Wei Lu, Jing‐Yuan Lin et al. · Electrochemical and Solid-State Letters · 2011 · 45 citations · Full text

Materials Science, 3D Ic Architecture, Copper Fill +15

Effects of supporting electrolytes on copper electroplating for filling through-hole

Chien‐Hung Chen, Chun-Wei Lu, Sumei Huang et al. · Electrochimica Acta · 2011 · 44 citations

Materials Science, Electrometallurgy, Chemical Engineering +3

Effects of organic acids on through-hole filling by copper electroplating

Jhih-Jyun Yan, Liang-Chun Chang, Chun-Wei Lu et al. · Electrochimica Acta · 2013 · 42 citations

Materials Science, Electrometallurgy, Chemical Engineering +4

The growth of interfacial compounds between titanium dioxide and bismuth oxide

Chun-Wei Lu, L.-S. Chang, Yong Lu et al. · Ceramics International · 2009 · 13 citations

Materials Science, Materials Engineering, Bismuth Oxide +9