Concepedia

Jhih-Jyun Yan

JY

Statistics

Publications

3

Citations

142

H-Index

3

Active since

2010

Affiliations

National Chung Hsing University(Current)

R.O.C Military Academy

Jhih-Jyun Yan is an author at National Chung Hsing University specializing in chemical engineering, electrochemistry, and materials science.

Top concepts

Publications per year

2010–2013

3

Publications

3

Through-Hole Filling by Copper Electroplating Using a Single Organic Additive

Wei‐Ping Dow, De-Huei Liu, Chun-Wei Lu et al. · Electrochemical and Solid-State Letters · 2010 · 52 citations

, , +9

Characterization of Through-Hole Filling by Copper Electroplating Using a Tetrazolium Salt Inhibitor

Guan-Ye Lin, Jhih-Jyun Yan, Ming-Yao Yen et al. · Journal of The Electrochemical Society · 2013 · 48 citations

, , +15

Effects of organic acids on through-hole filling by copper electroplating

Jhih-Jyun Yan, Liang-Chun Chang, Chun-Wei Lu et al. · Electrochimica Acta · 2013 · 42 citations

, , +4

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