Concepedia

Thomas F. Redmond

TF

Statistics

Publications

6

Citations

182

H-Index

6

Active since

1968

Affiliations

IBM (United States)(Current)

Thomas F. Redmond is an author at IBM (United States) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingApplied PhysicsMicrofabricationChemistryThin FilmsMicroelectronicsChemical KineticsAdvanced Packaging

Publications per year

1968–2003

6

Publications

6

Dimerization of nitrogen dioxide in solution: a comparison of solution thermodynamics with the gas phase

Thomas F. Redmond, Bradford B. Wayland · The Journal of Physical Chemistry · 1968 · 60 citations

Engineering, Chemical Analysis, Altmetric Attention Score +18

Polyimide copper thin film redistribution on glass ceramic/copper multilevel substrates

Thomas F. Redmond, C. Prasad, G. A. Walker · 2002 · 43 citations

Engineering, Electron-beam Lithography, Glass Material +19

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution

Rao Tummala, John Knickerbocker, Sarah H. Knickerbocker et al. · IBM Journal of Research and Development · 1992 · 41 citations

Materials Science, Glass-ceramic, Molybdenum Paste +15

The application of laser process technology to thin film packaging

Thomas F. Redmond, J. R. Lankard, J.G. Balz et al. · 2003 · 17 citations

Laser Processing (Laser Material Processing), Engineering, Laser Applications +20

Comments on the planarity of dinitrogen tetroxide

Thomas F. Redmond, Bradford B. Wayland · The Journal of Physical Chemistry · 1968 · 11 citations

Altmetric Attention Score, Bibliometrics, Organic Chemistry +19

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