Bo‐In Park

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Ji Ho Shin, Hyunseok Kim, Suresh Sundaram et al. · Nature · 2023 · 284 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +12

Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

Yeongin Kim, Jun Min Suh, Ji Ho Shin et al. · Science · 2022 · 272 citations

Engineering, Bioengineering, Materials Science +17

Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions

Ji‐Hoon Kang, Heechang Shin, Ki Seok Kim et al. · Nature Materials · 2023 · 194 citations

Engineering, Materials Engineering, Materials Science +14

Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence

Chanyeol Choi, Hyunseok Kim, Ji‐Hoon Kang et al. · Nature Electronics · 2022 · 136 citations

Engineering, Computer Engineering, Computer Science +16

RTA-Treated Carbon Fiber/Copper Core/Shell Hybrid for Thermally Conductive Composites

Seunggun Yu, Bo‐In Park, Cheolmin Park et al. · ACS Applied Materials & Interfaces · 2014 · 64 citations

Natural Sciences, Materials Engineering, Materials Science +17