Ji‐Hoon Kang

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Ji Ho Shin, Hyunseok Kim, Suresh Sundaram et al. · Nature · 2023 · 262 citations · Full text

Materials Science, Solid-state Lighting, Engineering +6

Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

Yeongin Kim, Jun Min Suh, Ji Ho Shin et al. · Science · 2022 · 253 citations

Engineering, Electronic Skin, Wearable Technology +22

Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins

Han-Wool Yeon, Han Eol Lee, Yeongin Kim et al. · Science Advances · 2021 · 169 citations · Full text

Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions

Ji‐Hoon Kang, Heechang Shin, Ki Seok Kim et al. · Nature Materials · 2023 · 169 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +13

Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence

Chanyeol Choi, Hyunseok Kim, Ji‐Hoon Kang et al. · Nature Electronics · 2022 · 125 citations

Artificial Intelligence, System On Chip, Hardware Architecture +13