Ji Ho Shin

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Ji Ho Shin, Hyunseok Kim, Suresh Sundaram et al. · Nature · 2023 · 262 citations · Full text

Materials Science, Solid-state Lighting, Engineering +6

Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors

Yeongin Kim, Jun Min Suh, Ji Ho Shin et al. · Science · 2022 · 253 citations

Engineering, Electronic Skin, Wearable Technology +22

Thermally Triggered Degradation of Transient Electronic Devices

Chan Woo Park, Seung‐Kyun Kang, Hector Lopez Hernandez et al. · Advanced Materials · 2015 · 180 citations

Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence

Chanyeol Choi, Hyunseok Kim, Ji‐Hoon Kang et al. · Nature Electronics · 2022 · 125 citations

Artificial Intelligence, System On Chip, Hardware Architecture +13

Dynamic evolution of nanosized NbC precipitates in austenite matrix during deformation and its contribution to strengthening

Ji Ho Shin, Byeong Seo Kong, Hyun Joon Eom et al. · Materials Science and Engineering A · 2021 · 27 citations

Materials Science, Engineering, Severe Plastic Deformation +8