Statistics
Publications
2
Citations
35
H-Index
2
Active since
2017
Affiliations
University of Bern(Current)
Hyo-eun Kim is an author at University of Bern specializing in referred pain patterns, packaging design, and computer engineering.
Publications per year
2017–2021
2
2
CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference
Sun-Kyoung Seo, Chajea Jo, Mina Choi et al. · 2021 · 16 citations
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