Concepedia

Chajea Jo

CJ

Statistics

Publications

4

Citations

73

H-Index

4

Active since

2021

Affiliations

Samsung (South Korea)(Current)

Chajea Jo is an author at Samsung (South Korea) specializing in engineering, semiconductor devices, and chip packaging.

Publications per year

2021–2023

4

Publications

4

Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications

Yeongseon Kim, Juhyeon Kim, Hyoeun Kim et al. · 2023 · 28 citations

Engineering, Materials Science, Electronic Materials +16

A study on bonding pad structure and layout for Fine pitch hybrid bonding

Juhyeon Kim, Sun-Kyoung Seo, Hyoeun Kim et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 17 citations

Engineering, Materials Engineering, Materials Science +15

CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference

Sun-Kyoung Seo, Chajea Jo, Mina Choi et al. · 2021 · 16 citations

Engineering, Computer Engineering, Computer Science +17

Process and Design Optimization for Hybrid Cu Bonding Void

Hyoeun Kim, Juhyeon Kim, Yeongseon Kim et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 12 citations

Engineering, Materials Science, Electronic Materials +15

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