S. Massoud-Ansari

Chip-level vacuum packaging of micromachines using nanogetters

D.R. Sparks, S. Massoud-Ansari, N. Najafi · IEEE Transactions on Advanced Packaging · 2003 · 88 citations

Engineering, Mechanical Engineering, Microelectromechanical Systems +16

Long-term evaluation of hermetically glass frit sealed silicon to Pyrex wafers with feedthroughs

D.R. Sparks, S. Massoud-Ansari, Nader Najafi · Journal of Micromechanics and Microengineering · 2005 · 66 citations

Engineering, Mechanical Engineering, Glass Frit +16

An all-glass chip-scale MEMS package with variable cavity pressure

D.R. Sparks, Jacob Trevino, S. Massoud-Ansari et al. · Journal of Micromechanics and Microengineering · 2006 · 41 citations

Electrical Engineering, Wafer Scale Processing, Engineering +12

Reliable vacuum packaging using NanoGetters and glass frit bonding

D.R. Sparks, S. Massoud-Ansari, Nader Najafi · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2004 · 38 citations

Engineering, Mechanical Engineering, Vacuum Device +17

An ultra-sensitive, high-vacuum absolute capacitive pressure sensor

Yafan Zhang, S. Massoud-Ansari, Guangqing Meng et al. · 2002 · 37 citations

Non-contact Sensing, Electrical Engineering, Engineering +12