Shilai Liu

Publications

Citations

H-Index

2004

Active since

Affiliations

Hong Kong University of Science and Technology(Current)

Shilai Liu is an author at Hong Kong University of Science and Technology specializing in applied physics, mechanics of materials, and electronic packaging.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationElectronic PackagingMaterials EngineeringMechanical EngineeringMechanics Of Materials

Publications per year

2004–2004

Publications

Effects of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die

Neil Mclellan, Nelson Fan, Shilai Liu et al. · Journal of Electronic Packaging · 2004 · 66 citations

Engineering, Mechanical Engineering, Wafer Thinning Condition +19

Rows per page

1–1 of 1