Hoonjoo Na

A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization

Yunjae Suh, Seungnam Choi, Masamichi Ito et al. · 2020 · 97 citations

Motion Detection, Image Sensor, Machine Vision +14

Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

Taeseong Kim, Sohye Cho, SeonKwan Hwang et al. · 2021 · 34 citations

Engineering, Cu Hybrid Bonding, Interconnect (Integrated Circuits) +18

Cu Microstructure of High Density Cu Hybrid Bonding Interconnection

Seokho Kim, Pilkyu Kang, Taeyeong Kim et al. · 2019 · 33 citations

Engineering, Cu Microstructure, Interconnect (Integrated Circuits) +18

Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding

Seongmin Son, Junhong Min, Eunsuk Jung et al. · 2020 · 25 citations

Engineering, Low-temperature Wafer Bonding, Plasma Processing +18

High-quality schottky and ohmic contacts in planar 4H-SiC metal semiconductor field-effect transistors and device performance

Hoonjoo Na, Hyeongjoon Kim, Kazuhiro Adachi et al. · Journal of Electronic Materials · 2004 · 22 citations

Electrical Engineering, Semiconductor Device, Engineering +6