Seokho Kim

Cu Microstructure of High Density Cu Hybrid Bonding Interconnection

Seokho Kim, Pilkyu Kang, Taeyeong Kim et al. · 2019 · 33 citations

Engineering, Cu Microstructure, Interconnect (Integrated Circuits) +18

Characteristics of Plasma-activated Dielectric Film Surfaces for Direct Wafer Bonding

Seongmin Son, Junhong Min, Eunsuk Jung et al. · 2020 · 25 citations

Engineering, Low-temperature Wafer Bonding, Plasma Processing +18

Delamination Characteristics of Single Layer and Stacked HTS Coated Conductor for Conduction Cooling Application

Heecheol Park, Hwanjun Jung, Seokho Kim et al. · IEEE Transactions on Applied Superconductivity · 2012 · 23 citations

Engineering, Mechanical Engineering, Cold Working +20

Growth and Brilliant Photo-Emission of Crystalline Hexagonal Column of Alq3 Microwires

Seokho Kim, Do Yun Kim, Jinho Choi et al. · Materials · 2018 · 17 citations · Full text

Materials Science, Aluminium Nitride, Alq3 Microwires +13

Age-associated chromatin relaxation is enhanced in Huntington’s disease mice

Myungsun Park, Byungkuk Min, Kyuheum Jeon et al. · Aging · 2017 · 15 citations

Epigenetic Change, Genetics, Molecular Biology +19