Statistics
Publications
1
Citations
66
H-Index
1
Active since
2009
Affiliations
STATS ChipPAC (Singapore)(Current)
Meenakshi Padmanathan is an author at STATS ChipPAC (Singapore) specializing in integrated circuit fabrication, three-dimensional integration, and wafer bonding.
Publications per year
2009–2009
1
1
3D TSV processes and its assembly/packaging technology
Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo et al. · 2009 · 66 citations
1–1 of 1