Statistics
Publications
3
Citations
124
H-Index
3
Active since
2009
Affiliations
Amkor Technology (United States)(Current)
Choonheung Lee is an author at Amkor Technology (United States) specializing in bonding, wafer bonding, and flip-chip bonding.
Publications per year
2009–2016
3
3
Study of interconnection process for fine pitch flip chip
Minjae Lee, Min Seok Yoo, J. Cho et al. · 2009 · 63 citations
Development of large die fine pitch flip chip BGA using TCNCP technology
Yang-Gyoo Jung, Minjae Lee, Dongsu Ryu et al. · 2012 · 20 citations
1–3 of 3