Kouji Sakamoto

Demonstration of High Electrical Reliability of Sub-2 Micron Cu Traces Covered with Inorganic Dielectrics for Advanced Packaging Technologies

Hiroshi Kudo, Ryohei Kasai, Jyunichi Suyama et al. · 2017 · 33 citations

Engineering, Electrical Engineering, Materials Science +17

Demonstration of high electromigration resistance of enhanced sub-2 micron-scale Cu redistribution layer for advanced fine-pitch packaging

Hiroshi Kudo, Ryohei Kasai, Jyunichi Suyama et al. · 2017 · 21 citations

Engineering, Electrical Engineering, Materials Science +15

Promoted cell proliferation by connexin 30 gene transfection to head-and-neck cancer cell line.

Hiroyuki Ozawa, Hideki Mutai, Tatsuo Matsunaga et al. · PubMed · 2009 · 16 citations

Medicine, Cell Biology, Oncology +12

High-speed, High-density, and Highly-manufacturable Cu-filled Through-Glass-Via Channel (Cu bridge) for Multi-chiplet Systems

Hiroshi Kudo, Takamasa Takano, Miyuki Akazawa et al. · 2021 · 12 citations

Engineering, Materials Engineering, Materials Science +14