Jack Knoll is an author at Virginia Tech specializing in electronic packaging, power electronic devices, and thermal engineering.
Top concepts
EngineeringHeat TransferMicroelectronicsThermal EngineeringElectronic PackagingElectrical EngineeringPower Electronic DevicesPhysicsRf DevicesThermodynamics
Publications per year
2021–2022
4
4
Design and Analysis of a PCB-Embedded 1.2 kV SiC Half-Bridge Module
Jack Knoll, Gibong Son, Christina DiMarino et al. · 2021 · 13 citations
Thermal Dissipation Approach Comparison and Evaluation for SiC Surface Mount Devices
V. Baker, Boran Fan, Jack Knoll et al. · 2021 · 11 citations
Rows per page
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