Cindy Mao

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Active since

2014

Affiliations

Siliconware Precision Industries (Taiwan)(Current)

Cindy Mao is an author at Siliconware Precision Industries (Taiwan) specializing in surface current density, packaging engineering, and packaging materials.

Publications per year

2014–2015

Publications

Electromigration performance of Cu pillar bump for flip chip packaging with bump on trace by using thermal compression bonding

Kuei Hsiao Kuo Frank, Jason Lee, Feng Lung Chien et al. · 2014 · 17 citations

Natural Sciences, Electrical Engineering, Materials Science +15

The impact and performance of electromigration on fine pitch Cu pillar with different bump structure for flip chip packaging

Kuei Hsiao Kuo, Cindy Mao, Katch Wang et al. · 2015 · 10 citations

Engineering, Electrical Engineering, Materials Science +16

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