Concepedia

H. M. Clearfield

HM

10

Publications

276

Citations

10

H-Index

1981

Active since

Affiliations

University of Wisconsin–Madison(Current)

Lockheed Martin (Canada)

H. M. Clearfield is an author at University of Wisconsin–Madison specializing in engineering, materials science, and materials engineering.

Top concepts

EngineeringMaterial ScienceApplied PhysicsMaterials EngineeringSurface ScienceMicroelectronicsElectronic PackagingElectrical EngineeringMaterial CharacterizationPhysics

Publications per year

1981–2002

10

Publications

10

An XPS investigation of the adsorption of aminosilanes onto metal substrates

M. Horner, F. J. Boerio, H. M. Clearfield · Journal of Adhesion Science and Technology · 1992 · 75 citations

Moisture-induced interfacial oxidation of chromium on polyimide

B. K. Furman, K. D. Childs, H. M. Clearfield et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1992 · 34 citations

Engineering, Oxidation Resistance, Plasma Processing +17

Surface Preparation of Ti-6Al-4V for High-Temperature Adhesive Bonding

H. M. Clearfield, D. K. Shaffer, S. L. Vandoren et al. · The Journal of Adhesion · 1989 · 33 citations

Materials Engineering, Materials Science, Surface Preparation +15

Wafer-level chip scale packaging: benefits for integrated passive devices

H. M. Clearfield, J.L. Young, S.D. Wijeyesekera et al. · IEEE Transactions on Advanced Packaging · 2000 · 30 citations

Integrated Passive Devices, Electrical Engineering, Chip-scale Package +13

Adhesion Tensile Testing of Environmentally Exposed Ti-6Al-4V Adherends

H. M. Clearfield, D. K. Shaffer, J. S. Ahearn et al. · The Journal of Adhesion · 1987 · 20 citations

Materials Science, Materials Engineering, Chemical Engineering +15

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