Naoki Wakasugi

Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

Dongjin Kim, Shijo Nagao, Chuantong Chen et al. · IEEE Transactions on Power Electronics · 2020 · 81 citations

Engineering, Materials Engineering, Materials Science +17

High-quality antiferromagnetic EuTiO3 epitaxial thin films on SrTiO3 prepared by pulsed laser deposition and postannealing

Koji Fujita, Naoki Wakasugi, Shunsuke Murai et al. · Applied Physics Letters · 2009 · 63 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm² Power Cycling Tests

Chuantong Chen, Dongjin Kim, Zheng Zhang et al. · IEEE Transactions on Power Electronics · 2022 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +17

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao et al. · Micromachines · 2019 · 26 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability

Chuantong Chen, Aiji Suetake, Fupeng Huo et al. · IEEE Transactions on Power Electronics · 2024 · 25 citations · Full text

Engineering, Materials Engineering, Materials Science +17