Concepedia

Aiji Suetake

AS

Statistics

Publications

11

Citations

382

H-Index

11

Active since

2018

Affiliations

The University of Osaka(Current)

Osaka Research Institute of Industrial Science and Technology

Yamato University

Korea Institute of Industrial Technology

Aiji Suetake is an author at The University of Osaka specializing in materials science, materials engineering, and electronic materials.

Publications per year

2018–2024

11

Publications

11

Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

Dongjin Kim, Shijo Nagao, Chuantong Chen et al. · IEEE Transactions on Power Electronics · 2020 · 81 citations

Engineering, Materials Engineering, Materials Science +17

Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste

Zheng Zhang, Chuantong Chen, Aiji Suetake et al. · Scripta Materialia · 2021 · 61 citations

Engineering, Materials Engineering, Materials Science +14

Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests

Zheng Zhang, Chuantong Chen, Aiji Suetake et al. · Journal of Electronic Materials · 2021 · 47 citations

Engineering, Manufacturing Engineering, Heat Transfer +14

Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm<sup>2</sup> Power Cycling Tests

Chuantong Chen, Dongjin Kim, Zheng Zhang et al. · IEEE Transactions on Power Electronics · 2022 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +17

Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test

Chuantong Chen, Zheng Zhang, Dongjin Kim et al. · Journal of Alloys and Compounds · 2021 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +17

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