Single wafer encapsulation of mems devices

Rob N. Candler, Woo‐Tae Park, G. Yama, +3

IEEE Transactions on Advanced Packaging

Piezoresistive AccelerometersMems DevicesEngineeringDevice IntegrationMechanical Engineering +15

Impact of Geometry on Thermoelastic Dissipation in Micromechanical Resonant Beams

Rob N. Candler, Amy Duwel, M. Varghese, +8

Journal of Microelectromechanical Systems

EngineeringMultiscale MechanicsMicromechanicsMechanical EngineeringMicroactuator +15

A Precision Yaw Rate Sensor in Silicon Micromachining

M. Lutz, Jiří Marek, B. Maihöfer, +3

SAE technical papers on CD-ROM/SAE technical paper series

MEMS Oscillators for High Volume Commercial Applications

M. Lutz, Aaron Partridge, Pallavi Gupta, +4

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference

Advanced PackagingElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors) +13

A precision yaw rate sensor in silicon micromachining

M. Lutz, W. Golderer, J. Gerstenmeier, +5

EngineeringMicromachinesSensorsMicrofabricationCalibration +13

New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers

Aaron Partridge, A.E. Rice, Thomas W. Kenny, +1

Piezoresistive AccelerometersEngineeringThin Film EncapsulationMechanical EngineeringSensor Technology +15

Encapsulated Submillimeter Piezoresistive Accelerometers

Woo‐Tae Park, Aaron Partridge, Rob N. Candler, +4

Journal of Microelectromechanical Systems

EngineeringMeasurementMechanical EngineeringAccelerometerWearable Technology +19

ACTIVE TEMPERATURE COMPENSATION FOR MICROMACHINED RESONATORS

Matthew A. Hopcroft, Renata Melamud, Rob N. Candler, +6

2004 Solid-State, Actuators, and Microsystems Workshop Technical Digest

Wafer-scale film encapsulation of micromachined accelerometers

Woo‐Tae Park, Rob N. Candler, S. Kronmueller, +4

Materials ScienceAdvanced PackagingElectrical EngineeringSuccessful Mems DevicesEngineering +13

Using MEMS to Build the Device and the Package

B. Kim, Matthew A. Hopcroft, C.M. Jha, +10

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference

Industrial DesignFragile MemsMems DevicesEngineeringChip-scale Package +12