Sandy Klengel

Publications

Citations

H-Index

2011

Active since

Affiliations

Fraunhofer Institute for Microstructure of Materials and Systems(Current)

Fraunhofer Institute for Mechanics of Materials

Sandy Klengel is an author at Fraunhofer Institute for Microstructure of Materials and Systems specializing in electrical engineering, engineering, and electronic packaging.

ORCID

Top concepts

EngineeringElectrical EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringMechanical EngineeringApplied PhysicsCorrosionMicrostructureMicroelectronics

Publications per year

2011–2020

Publications

Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density

Bianca Boettge, Falk Naumann, Stefan Behrendt et al. · 2018 · 16 citations

Engineering, Cement Manufacture, Mechanical Engineering +20

A New Reliable, Corrosion Resistant Gold-Palladium Coated Copper Wire Material

Sandy Klengel, Robert Klengel, Jan Schischka et al. · 2019 · 15 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Acoustic imaging of bump defects in flip-chip devices using split spectrum analysis

Sebastian Tismer, Sebastian Brand, Sandy Klengel et al. · 2013 · 14 citations

Engineering, Split Spectrum Analysis, Acoustic Sensor +20

Reduction of soldering induced stresses in solar cells by microstructural optimization of copper-ribbons

Rico Meier, Matthias Pander, Robert Klengel et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2011 · 12 citations

Engineering, Severe Plastic Deformation, Mechanical Engineering +19

Influence of copper wire material to corrosion resistant packages and systems for high temperature applications

Sandy Klengel, Robert Klengel, Jan Schischka et al. · 2019 · 11 citations

Automotive Industry, Engineering, Corrosion Resistant Packages +16

Rows per page

1–5 of 6