Concepedia

Kati Aalto

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KA

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Publications

1

Citations

10

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1

Active since

2003

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Publications per year

2003–2003

1

Publications

1

Reducing bonding cycle time of adhesive flip chip process

Anne Seppälä, Kati Aalto, E. Ristolainen · Soldering and Surface Mount Technology · 2003 · 10 citations

Engineering, Materials Engineering, Materials Science +14

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