J.-P. Sommer

A 500 MHz time digitizer IC with 15.625 ps resolution

Thomas A. Knotts, David Chu, J.-P. Sommer · 2002 · 24 citations

Engineering, Computer Engineering, Electrical Engineering +13

High temperature potential of flip chip assemblies for automotive applications

Tanja Braun, K.-F. Becker, J.-P. Sommer et al. · 2005 · 21 citations

Engineering, Materials Engineering, Materials Science +17

Solder Fatigue at High-Power IGBT Modules

J.-P. Sommer, Thomas Licht, Hermann Berg et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 2006 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +17

Thermally optimised millimeter wave package on an LTCC ceramic board

J.-P. Sommer, B. Michel, U. Goebel et al. · 2002 · 14 citations

Engineering, Electrical Engineering, Materials Engineering +17

Application of electroplating in MEMS-micromachining exemplified by a microrelay

E. Kieselstein, J.-P. Sommer, K.J.J. Bramer et al. · Microsystem Technologies · 2001 · 12 citations

Engineering, Manufacturing Engineering, Mechanical Engineering +10