Statistics
Publications
6
Citations
219
H-Index
6
Active since
2001
Affiliations
Toyama Prefectural University(Current)
Morihiro Kada is an author at Toyama Prefectural University specializing in engineering, chip packaging, and packaging design.
Publications per year
2001–2012
6
6
A Study on Package Stacking Process for Package-on-Package (PoP)
Akito Yoshida, Jun Taniguchi, K. Murata et al. · 2006 · 94 citations
Engineering, Computer Engineering, Manufacturing Engineering +14
Board level reliability of CSP
Hiroyuki Juso, Yasuhisa Yamaji, Takeshi Kimura et al. · 2002 · 43 citations
Engineering, Manufacturing Engineering, Materials Science +14
Y. Fukui, Yoichi Yano, Hiroyuki Juso et al. · 2002 · 27 citations
Engineering, Computer Engineering, Electrical Engineering +17
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