Concepedia

Po-Ning Hsu

PH

5

Publications

238

Citations

5

H-Index

2018

Active since

Affiliations

National Yang Ming Chiao Tung University(Current)

University of California, Los Angeles

Po-Ning Hsu is an author at National Yang Ming Chiao Tung University specializing in electronic packaging, applied physics, and engineering.

Top concepts

EngineeringApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingMicrostructureMaterials EngineeringMechanical EngineeringThin FilmsNanomaterials

Publications per year

2018–2021

5

Publications

5

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

Jing-Ye Juang, Chia-Ling Lu, Kuan‐Ju Chen et al. · Scientific Reports · 2018 · 101 citations · Full text

Electromigration failure mechanisms of 〈1 1 1〉 -oriented nanotwinned Cu redistribution lines with polyimide capping

I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu et al. · Results in Physics · 2021 · 46 citations · Full text

Materials Science, Cu Rdls, Electrical Engineering +14

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 42 citations · Full text

Materials Engineering, Materials Science, Cu-cu Bumps +15

A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu

Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li et al. · Journal of Materials Research and Technology · 2021 · 31 citations · Full text

Engineering, Cu Joint, Severe Plastic Deformation +22

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li et al. · Materials · 2021 · 18 citations · Full text

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