Po-Ning Hsu - Concepedia

Author

Po-Ning Hsu

Also Known As

Po-Ning Hsu

Publications

238

Citations

H-Index

Concepts

All Affiliations

Po-Ning Hsu is an author at National Yang Ming Chiao Tung University specializing in electronic packaging, applied physics, and engineering.

#	Concept	H-Index	Publications	Citations
1	Engineering	3	3	119
2	Applied Physics	3	3	119
3	Materials Science	3	3	119
4	Materials Engineering	2	2	73
5	Electrical Engineering	1	1	46

Po-Ning Hsu

Publications

238

Citations

H-Index

Page 1

	Year	Citations
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient Jing-Ye Juang, Chia-Ling Lu, Kuan‐Ju Chen, Scientific Reports	2018	101
Electromigration failure mechanisms of 〈1 1 1〉 -oriented nanotwinned Cu redistribution lines with polyimide capping I-Hsin Tseng, Po-Ning Hsu, Tien-Lin Lu, Results in Physics Materials ScienceCu RdlsElectrical EngineeringElectromigration TechniqueEngineering	2021	46
Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Materials Materials EngineeringMaterials ScienceCu-cu BumpsEngineeringAdvanced Packaging (Semiconductors)	2021	42
A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, Journal of Materials Research and Technology EngineeringCu JointSevere Plastic DeformationMechanical EngineeringInterconnect (Integrated Circuits)	2021	31
Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Materials	2021	18

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