Daeyong Shim

A 1.2V 64Gb 341GB/S HBM2 stacked DRAM with spiral point-to-point TSV structure and improved bank group data control

Jin Hee Cho, Jihwan Kim, Woo Young Lee et al. · 2018 · 58 citations

Hardware Security, Artificial Intelligence, Electrical Engineering +12

A Process-Variation-Tolerant On-Chip CMOS Thermometer for Auto Temperature Compensated Self-Refresh of Low-Power Mobile DRAM

Daeyong Shim, Hyunsik Jeong, Hyunjoong Lee et al. · IEEE Journal of Solid-State Circuits · 2013 · 39 citations

Low-power Mobile Dram, Engineering, Computer Architecture +16

22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST

Dong Uk Lee, Ho Sung Cho, Jihwan Kim et al. · 2020 · 31 citations

Electrical Engineering, Hbm2e Dram, Engineering +15

Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

Kyungjun Cho, Joungho Kim, Youngwoo Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2019 · 29 citations

Engineering, Power Electronics, Physical Design (Electronics) +18