Concepedia

Joerg Froemel

JF

7

Publications

156

Citations

7

H-Index

2011

Active since

Affiliations

Tohoku University(Current)

Advanced Institute of Materials Science

Fraunhofer Institute for Electronic Nano Systems

Chemnitz University of Technology

Joerg Froemel is an author at Tohoku University specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringMechanical EngineeringApplied PhysicsSurface ScienceMicrofabricationSensors

Publications per year

2011–2022

7

Publications

7

Investigations of thermocompression bonding with thin metal layers

Joerg Froemel, Marianna K. Baum, Maik Wiemer et al. · 2011 · 36 citations · Full text

Engineering, Mechanical Engineering, Thermal Conductivity +19

Low-Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism

Joerg Froemel, Mario Baum, Maik Wiemer · Journal of Microelectromechanical Systems · 2015 · 30 citations

Engineering, Low-temperature Wafer Bonding, Wafer Scale Processing +17

Laterally vibrating MEMS resonant vacuum sensor based on cavity-SOI process for evaluation of wide range of sealed cavity pressure

Cong Liu, Joerg Froemel, Jianlin Chen et al. · Microsystem Technologies · 2018 · 28 citations

Cavity-soi Process, Sealed Cavity Pressure, Engineering +9

Development of PVDF-TrFE/SiO2 composite film bulk acoustic resonator

Ryosuke Kaneko, Joerg Froemel, Shuji Tanaka · Sensors and Actuators A Physical · 2018 · 20 citations

Materials Engineering, Materials Science, Engineering +5

Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

Koki Tanaka, Wei-Shan Wang, Mario Baum et al. · Micromachines · 2016 · 18 citations · Full text

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