Concepedia
Statistics
Publications
4
Citations
65
H-Index
Active since
2013
Affiliations
University of Hong Kong(Current)
Hong Kong University of Science and Technology
Qiming Zhang is an author at University of Hong Kong specializing in heat transfer, thermal analysis, and engineering.
Publications per year
2013–2017
Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays
Qiming Zhang, Chaoran Yang, Mian Tao et al. · 2013 · 21 citations
Engineering, Manufacturing Engineering, Materials Science +8
3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing
Fuliang Le, S. W. Ricky Lee, Qiming Zhang · Journal of Micromechanics and Microengineering · 2017 · 19 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +17
Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation
Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee et al. · 2016 · 13 citations
Natural Sciences, Materials Engineering, Materials Science +16
Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering
Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee · 2016 · 12 citations
Engineering, Materials Engineering, Materials Science +13
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