Fuliang Le

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Publications

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Active since

2016

Affiliations

Hong Kong University of Science and Technology(Current)

University of Hong Kong

Fuliang Le is an author at Hong Kong University of Science and Technology specializing in through-silicon vias, flip-chip packaging, and intermetallic compound formation.

ORCID

Publications per year

2016–2017

Publications

Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints

Chaoran Yang, Fuliang Le, S. W. Ricky Lee · Microelectronics Reliability · 2016 · 35 citations

Natural Sciences, Materials Engineering, Materials Science +13

3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing

Fuliang Le, S. W. Ricky Lee, Qiming Zhang · Journal of Micromechanics and Microengineering · 2017 · 19 citations · Full text

Engineering, Computer Engineering, Electrical Engineering +17

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